Waferpedia

Comparison ledger

DCS 1460 Wafer Cleaner Spinversus11600 SRD

Disco DCS 1460 Wafer Cleaner Spin, Semitool 11600 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11600 SRDSemitool
OEMDiscoSemitool
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DCSSemitool 11600 SRD
Specifications
ConfigurationTable upgrade for VCSEL cleaning[1]Ceramic[3]
Maximum workpiece sizeΦ300 mm[2]—
Application frame2-12[2]—
Table RPM range100 to 3,000 min⁻¹[2]—
Setting time for cleaning/drying0 to 999 sec[2]—
Cleaning nozzle speed1 to 37.5 °/sec[2]—
Cleaning rangeΦ450 mm (up to 310 x 310 mm)[2]—
Cleaning pressure range2.3 to 11.8 MPa[2]—
Equipment dimensions (W×D×H)500 × 650 × 1,220 mm[2]—
Equipment weight (Dry mass)Approx. 144 kg[2]—
Max. workpiece sizeΦ300 mm[2]—
Table RPM100 to 3,000 min^-1[2]—
Cleaning nozzlesStandard high pressure cleaning nozzle; optional atomizing cleaning nozzle; dual nozzle configuration possible[2]—
Operator interface4 inch LCD touch panel[2]—
Manufacturer—Semitool[3]
Model—11600 SRD[3]
Equipment type—Spin Rinse Dryer[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.com.sgdisco.com.sg
  3. [3]inventory listing