Comparison ledger
Disco DFG 841 Grinder Lapper, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | CMP | CMP |
| Wafer size | Robot Unit– automated wafer handling between cassettes and chuck tables. | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG 841 | — |
| Specifications | ||
| Spindle Speed (Max) | 7,000 rpm[1] | — |
| Power | AC 200V, 50/60 Hz, 3-Phase, 17 kVA[1] | — |
| Air Requirement | 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)[1] | — |
| Cutting Water | 0.2 MPa (2 kgf/cm²), 15 L/min[1] | — |
| Cooling Water | 0.2 MPa (2 kgf/cm²), 11 L/min[1] | — |
| Grinding Method | In-feed grinding with wafer rotation[1] | — |
| Accuracy | Planarity ≤ 1.5 µm across wafer[1] | — |
| Configuration | Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).[1] | — |
| Wafer size | Robot Unit– automated wafer handling between cassettes and chuck tables.[1] | — |
| Spindle options | Configurable for coarse + fine grind[1] | — |
| Make | Disco[1] | — |
| Model | DFG 841[1] | — |
| Tool type | Grinder / Lapper / Polisher[1] | — |
| Planarity accuracy | ≤ 1.5 µm across wafer[1] | — |
| Vacuum coolant unit | Provides cooling and chip removal; separate floor-standing unit[1] | — |
| Chiller unit | Stabilizes grinding fluid temperature[1] | — |
| Filter unit | For grinding water/coolant circulation[1] | — |
| Robot unit | Automated wafer handling between cassettes and chuck tables[1] | — |
| Transformer | 20 kVA, Tokyo Sanyo Denki; converts facility power (208–415 V input to 200 V output)[1] | — |
| Electrical compartment | Control and power distribution[1] | — |
| Chuck tables | Two chuck tables, porous vacuum type[1] | — |
| Cassette handling | Automatic cassette loading/unloading with same-cassette return[1] | — |
| Wafer thickness measurement | Contact gauge system[1] | — |
| Control/software | With HDD and Software[1] | — |
| Outside plate diameter | — | 12 inches[2] |
| Lapping Speed Range | — | 0 to 60 rpm[3] |
| Wafer Size Compatibility | — | 4 inches or smaller[2] |
| Input Voltage | — | 110 V[2] |
| Frequency | — | 60 Hz[2] |
| Phase | — | 1[2] |
| Number of Rings | — | 3[2] |
| Number of Weights | — | 3[2] |
| Includes Slurry System | — | Yes[2] |
| Includes Timer | — | Yes[2] |