Comparison ledger
Disco DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100R16Strasbaugh | |
|---|---|---|
| OEM | Disco | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG | Strasbaugh 100R16 |
| Specifications | ||
| DFG 8760 | 3 Axis Dry Polishing Type 2[1] | — |
| Configuration | Z1, Z2 Grinder[1] | — |
| Make | Disco[2] | — |
| Model | DFG 8760 / DFM 2700[2] | — |
| Equipment type | In-Line Wafer Grinder / Lapper / Polisher[2] | — |
| Wafer sizes | 12 inch[1] | — |
| Polishing type | 3 Axis Dry Polishing Type[1] | — |
| Axis / station configuration | Z1, Z2 Grinder - Z3 Polisher[1] | — |
| Includes | Z2 NCG; Auto Label Printer; Dicing Tape Pre-Cut Unit; HDD & Software[1] | — |
| Vintage | 2006[1] | — |
| type | — | 1 spindle grinder/polisher[3] |
| drive system | — | DC drive system with 2 motors[3] |
| spindle RPM | — | 1-180 RPM[3] |
| eccentric RPM | — | 1-90 RPM[3] |
| controls | — | digital timer; air down switch; spindle and eccentric speed dials; air regulators[3] |
| capacity | — | 16 inches[3] |
| spindle size | — | 1-8 TPI[3] |
| overall dimensions | — | 28 inches x 36 inches x 48 inches[3] |
| weight | — | 500 lbs[3] |
| origin | — | made in the USA[3] |