Waferpedia

Comparison ledger

DFL 7361versus15

Disco DFL 7361, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFLLapmaster 15
Cited variants
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
  • DFL7360[2]
  • DFL7360FH[2]
  • DFL7341[2]
  • DFL7340[2]
  • DFL7161[1]
—
Specifications
ConfigurationType FX Laser Head[1]—
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle[1]—
Max workpiece sizeø300 mm[2]—
Processing modeFully automatic[2]—
X-axis feed speed range0.1 - 1,000 mm/s[2]—
Y-axis positioning accuracy0.003 mm within 310 mm[2]—
Dimensions (W x D x H)1,210 x 3,270 x 1,906 mm[2]—
Weightapprox 2,570 kg[2]—
Supported wafer size2" to 12"[1]—
Laser headType FX[1]—
Optics systemBSS-6[1]—
Wafer cleaning systemIntegrated with Atomizing Nozzle[1]—
OEMDisco[1]—
ModelDFL 7361[1]—
CategoryLaser Saw[1]—
Maximum workpiece sizeø300 mm[2]—
Processing methodFully automatic[2]—
Dimensions (WxDxH)1,210 x 3,270 x 1,906 mm[2]—
Chuck tableChuck Table moving in X- and Y-direction; 12" and 8" Porous Chuck Table & Spinner Table[1]—
User interfaceGraphical User Interface with Touch Screen[1]—
Vision systemHigh Resolution Image Processing System with Auto Focus[1]—
Frame handlingFully Automatic Frame Handling System[1]—
Coating systemIndependent Hogomax spin coating system[1]—
Loading/unloadingCassette Loading / Unloading[1]—
Duct unitDuct Unit (Internal Type)[1]—
Power conditioningOverseas Transformer Unit; Uninterruptible Power Supply[1]—
DocumentationOperation & Troubleshooting Manual (English); Installation and 3-days Operation Training[1]—
Ablation processing supportSupports ablation processing; corresponding to 300mm workpiece[2]—
Laser Head TypeType FX[1]—
Chuck Table MovementX and Y direction[1]—
Image ProcessingHigh Resolution Image Processing System with Auto Focus[1]—
Spin Coating SystemIndependent Hogomax spin coating system[1]—
Chuck Table Sizes12" and 8" Porous Chuck Table & Spinner Table[1]—
Cassette HandlingCassette Loading / Unloading[1]—
Duct UnitInternal Type[1]—
TransformerOverseas Transformer Unit[1]—
Power SupplyUninterruptible Power Supply[1]—
X-Axis Feed Speed0.1 - 1,000 mm/s[2]—
Y-Axis Positioning Accuracy0.003 mm or less per 310 mm[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org