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Comparison ledger

1034versusSST C 421 280 Batch Wafer Processing

Electroglas 1034, Semitool SST C 421 280 Batch Wafer Processing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1034Electroglas
OEMElectroglasSemitool
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyElectroglas 1034Semitool SST C 421 280 Batch Wafer Processing
Specifications
Wafer Size—6 inch[1]
Vintage—2004[3]
Power—208 VAC[3]
Full Load Current—30 A[2]
Largest Motor or Load—10 A (15 HTR)[2]
Short Circuit Interrupt—10,000 A[2]
Heat Exchanger—Present[3]
Vacuum—Present[3]
CDA—65–70 PSI[3]
DI Water—35 PSI Minimum[3]
Process Gas—N₂ / CO₂[3]
Condition Note—Visible Corrosion on Modules[3]
Missing Components—Wafer Handler, Power Supply, AC Distribution Box, External Transformer, UPS, Backing Pump(s), Shipping Brackets[3]
Voltage—208 VAC[2]
Phase—3 Phase[2]
Wafer Sizes—6 inch, 8 inch (200mm)[2]
CDA Pressure—65–70 PSI[3]
DI Water Pressure (Minimum)—35 PSI[3]
Manufacturer—Semitool[2]
Model—SST C 421 280[2]
Frequency—50/60 Hz[2]
DI water pressure—35 PSI minimum[3]
Version—200mm[4]
Sales condition—as is where is[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com