Comparison ledger
Esec 2100 sD advanced i, Esec Esec 2009 fS E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Esec 2009 fS EEsec | |
|---|---|---|
| OEM | Esec | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 3rd generation | — |
| Family | Esec 2100 sD advanced i | Esec Esec 2009 fS E |
| Specifications | ||
| Bonding method | Epoxy[1] | — |
| Cycle time | 120 ms with Liquid Cooling option[1] | — |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[1] | — |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[1] | up to 8"[3] |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm[1] | 0.4 x 0.4 mm - 11 x 11 mm / 16 x 16 mils - 430 x 430 mils[3] |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[1] | — |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[1] | — |
| Product family listing | — | Listed among Esec die bonding products[1] |
| Product type | — | Soft solder die bonder[2] |
| Pick & place concept | — | Point-to-line pick & place with stationary indexer[3] |
| Net productivity | — | 2,500 to 8,000 UPH typical[3] |
| Temperature control | — | 8 zones, up to 450°C, ±5°C[3] |
| Frame size | — | 6", 8"[3] |
| Substrate and carrier size | — | Max length 285 mm; max width 60 mm[3] |
| Die placement accuracy | — | ± 80 µm / 0.6° (3σ)[3] |
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