Comparison ledger
EV Group 101, EV Group 6200 NT Semi Automated Bottom Side Alignment, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | EV Group 6200 |
| Specifications | ||
| OEM | EV Group[1] | EV Group[4] |
| Model | 101[1] | 6200 NT Semi Automated Bottom Side Alignment[4] |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Configuration | — | Double side[4] |
| Exposure Modes | — | Hard, Soft, & Vacuum Contact[4] |
| Separation Distance | — | 0 - 300 µm adjustable via software[4] |
| Wafer Thickness | — | 0.1 - 10 mm (For Top Side)[4] |
| Tool type | — | Mask alignment system[5] |
| Lithography use | — | Optical double-side lithography[5] |
| Wafer/substrate size | — | Up to 200 mm / 8 inch[5] |
| Bottom side alignment | — | ≤ ± 1.0 µm[5] |
| Top side alignment | — | ≤ ± 0.5 µm[5] |
| Exposure source | — | Mercury light source / UV LED light source[5] |
| Exposure setup | — | Vacuum contact / hard contact / soft contact / proximity mode / flex mode[5] |
| Throughput | — | Up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode[5] |
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