Waferpedia

Comparison ledger

101versusShapeGrabber Ai 310

EV Group 101, OGP ShapeGrabber Ai 310, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMEV GroupOGP
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101OGP (Optical Gaging Products) ShapeGrabber Ai 310
Specifications
OEMEV Group[1]—
Model101[1]ShapeGrabber Ai 310[4]
Equipment nameEVG 101 Spray Coater[1]ShapeGrabber Ai 310 Laser Scanner[4]
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]—
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Configuration—with computer[4]
Type—Automated 3D laser scanner[5]
Part size target—Small to medium complex-shaped parts[5]
Form factor—Compact, fits on workbench or standard inspection table[5]
Make—OGP (Optical Gaging Products)[4]
Description—Automated laser scanner[5]
Intended use—Scanning small to medium complex-shaped parts[5]
Associated configuration—With computer[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]inventory listing
  5. [5]qualitymag.comqualitymag.com