Comparison ledger
EV Group 501 Wafer, EV Group 520 IS Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 501 WaferEV Group | 520 IS WaferEV Group |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 501 Wafer | EV Group 520 |
| Specifications | ||
| Wafer size | Manual wafer load substrate bonder[1] | Manual wafer load substrate bonder[4] |
| Configuration | Capable of fusion compression bonding[1] | Refurbished[3] |
| Max Bond Force | 7 kN[1] | 60 kN[4] |
| Top side heater | 550°C max. in 1°C steps[1] | 550°C max. in 1°C steps[4] |
| Bottom side heater | 550°C max. in 1°C steps[1] | 550°C max. in 1°C steps[4] |
| Temperature uniformity | ± 1,5 %[1] | ± 1,5 %[4] |
| Wafer sizes | 2, 3, 4, 5, 6 inch (up to 150 mm)[1] | — |
| Substrate size | single chips to 200 mm[2] | — |
| Max bond force | 7 kN (source 1) or up to 20 kN (source 2)[1] | — |
| Top side heater max temperature | 550°C in 1°C steps (source 1)[1] | 550°C in 1°C steps[4] |
| Bottom side heater max temperature | 550°C in 1°C steps (source 1)[1] | 550°C in 1°C steps[4] |
| Maximum temperature (source 2) | up to 450°C[2] | — |
| Vacuum (standard) | 1x10-1 mbar[2] | — |
| Vacuum (optional) | 1x10-5 mbar[2] | — |
| Power supply for anodic bonding | 0-2000 V, 0-50 mA[2] | — |
| Footprint | 0.8 m2[2] | — |
| Conversion time | less than 5 minutes[2] | — |
| Control software | Windows-based[1] | Windows based control software and operation interface[4] |
| OEM | — | EV Group[3] |
| Model | — | 520 IS Wafer[3] |
| Category | — | Packaging & Bonding[5] |
| Description | — | Manual wafer load substrate bonder[5] |
| Bonding capabilities | — | Capable of fusion compression bonding, thermal compression bonding, and optional anodic bonding[4] |
| Bond chamber | — | High-vacuum capable bond chamber[4] |
| Included items | — | Chiller; turbo pump & controller; roughing pump; system computer, monitor, and keyboard[4] |
| Other stated features | — | Auto opening of bond tool cover; high-vacuum capable bond chamber; ideal for R&D and pilot production applications[4] |
| Vintage | — | 2008[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →