Comparison ledger
EV Group 510 Wafer, EV Group 520 IS Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 510 WaferEV Group | 520 IS WaferEV Group |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 510 | EV Group 520 |
| Specifications | ||
| Configuration | Refurbished[1] | Refurbished[4] |
| Wafer size | Manual wafer load substrate bonder[1] | Manual wafer load substrate bonder[5] |
| Max Bond Force | 10 kN[1] | 60 kN[5] |
| Top side heater | 550°C max. in 1°C steps[1] | 550°C max. in 1°C steps[5] |
| Bottom side heater | 550°C max. in 1°C steps[1] | 550°C max. in 1°C steps[5] |
| Temperature uniformity | ± 1,5 % Turbo pump and controller[1] | ± 1,5 %[5] |
| Manufacturer | EV Group[1] | — |
| Model | 510 Wafer[1] | 520 IS Wafer[4] |
| Category | Packaging & Bonding[2] | Packaging & Bonding[6] |
| Wafer handling | Manual wafer load substrate bonder[2] | — |
| Bonding capability | Fusion and thermal compression bonding[1] | — |
| Bond chamber | High-vacuum capable bond chamber[2] | High-vacuum capable bond chamber[5] |
| Control software | Windows based control software and operation interface[1] | Windows based control software and operation interface[5] |
| Turbo pump and controller | Included[1] | — |
| Roughing pump | Included[1] | — |
| System chiller | Included[1] | — |
| Load/unload tool | Included[1] | — |
| System computer, monitor, and keyboard | Included[1] | — |
| Vacuum | Standard: 0.1 mbar; optional: 1E-5 mbar[3] | — |
| Max temperature | 550 °C[3] | — |
| Loading chamber | Manual[3] | — |
| Max contact force | 10, 20, 60 kN[3] | — |
| Heater size | 150 mm, 200 mm[3] | — |
| Single chips processing | Yes[3] | — |
| Active water cooling | For bottom side[3] | — |
| Power supply for anodic bonding | Max voltage 2 kV; max current 50 mA[3] | — |
| OEM | — | EV Group[4] |
| Description | — | Manual wafer load substrate bonder[6] |
| Bonding capabilities | — | Capable of fusion compression bonding, thermal compression bonding, and optional anodic bonding[5] |
| Top side heater max temperature | — | 550°C in 1°C steps[5] |
| Bottom side heater max temperature | — | 550°C in 1°C steps[5] |
| Included items | — | Chiller; turbo pump & controller; roughing pump; system computer, monitor, and keyboard[5] |
| Other stated features | — | Auto opening of bond tool cover; high-vacuum capable bond chamber; ideal for R&D and pilot production applications[5] |
| Vintage | — | 2008[5] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →