Comparison ledger
EV Group Gemini, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | GeminiEV Group | 10490West Bond |
|---|---|---|
| OEM | EV Group | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group Gemini | West Bond 10490 |
| Cited variants | — | |
| Specifications | ||
| Bond force (300 mm GEMINI) | up to 350 kN[2] | — |
| Bond force (200 mm GEMINI) | up to 100 kN[2] | — |
| Overpressure capability (300 mm GEMINI) | up to 2000 mbar[2] | — |
| Overpressure capability (200 mm GEMINI) | up to 3000 mbar[2] | — |
| Wafer sizes (200 mm GEMINI) | 100 mm to 200 mm[2] | — |
| Wafer sizes (300 mm GEMINI) | 200 mm to 300 mm[2] | — |
| Max number of bond chambers | up to 4 bond modules[2] | — |
| Pre-process modules (200 mm GEMINI) | up to 4 pre-process modules[2] | — |
| Pre-process modules (300 mm GEMINI) | 2 to 6 pre-process modules[2] | — |
| Load ports (200 mm GEMINI) | EVG load ports or SMIF load ports[2] | — |
| Load ports (300 mm GEMINI) | FOUP load ports (optional adapter for 200 mm substrates)[2] | — |
| Bond alignment system | Field-proven SmartView® bond alignment system[2] | — |
| Wafer-to-wafer alignment accuracy (GEMINI FB) | sub 50 nm[1] | — |
| Max number of process modules (GEMINI FB) | 6 + SmartView® NT[1] | — |
| Wafer diameter (GEMINI FB) | 200, 300 mm[1] | — |
| Manufacturer | — | West Bond[3] |
| Model | — | 10490[3] |
| Description | — | Convertible bonder, wedge to ball[4] |
| Tool type | — | Convertible bonder[5] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
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