Comparison ledger
Hitachi 1305 BSG 3, MPM Momentum II 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | |
|---|---|---|
| OEM | Hitachi | MPM |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | MPM Momentum II 100 |
| Specifications | ||
| Configuration | — | Automatic Stencil Positioning[1] |
| Machine type | — | Stencil printer[2] |
| Automatic stencil positioning camera vision | — | Included[2] |
| Automatic stencil-to-board alignment | — | Included[2] |
| Stencil cleaner | — | UltraWipe stencil cleaner[2] |
| Maximum board size | — | 609.6 mm x 508 mm (24" x 20")[3] |
| Print speed | — | 0.635 mm/s - 304.8 mm/s[3] |
| Accuracy and repeatability | — | Cpk ≥ 2.0[3] |
| Wet print deposit | — | ±17 microns (±0.0007") at 6 sigma[3] |
| Alignment repeatability | — | ±11 microns @ 6 sigma[3] |
| Wet print accuracy | — | 20µm@6σ, Cpk ≥ 2[3] |
| Line-length reduction | — | 200 mm shorter than the standard Momentum II stencil printer platform[3] |
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