Comparison ledger
Hitachi 1305 BSG 3, SUSS MicroTec AS 8 Spray, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | AS 8 SpraySUSS MicroTec |
|---|---|---|
| OEM | Hitachi | SUSS MicroTec |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | SUSS MicroTec AS 8 |
| Specifications | ||
| Configuration | — | Semi Automatic[1] |
| Conformal Coating | — | ensures top edge coverage while avoiding resist accumulation in trenches[1] |
| Dual Dispense System | — | up to two separate spray dispense system to prevent cross-contamination[1] |
| Touchscreen Interface | — | equipped with MMC controller software[1] |
| Programmable Recipes | — | all spray and cleaning parameters can be customized and saved[1] |
| Operation type | — | Semi-automatic / semi-automated; manufacturer also describes it as a manual spray coater[1] |
| Substrate size | — | Substrates up to 200mm or 300mm in diameter, and square substrates up to 6" edge length[1] |
| Nozzle configuration | — | Dual Dispense System: up to two separate spray dispense systems to prevent cross-contamination[1] |
| Control interface | — | Touchscreen interface equipped with MMC controller software[1] |
| Recipe capability | — | Programmable recipes: all spray and cleaning parameters can be customized and saved[1] |
| Spray nozzle range | — | Nozzle adjustment from 67.5 mm to 107.5 mm; z-axis adjustment range up to 45 mm[2] |
| Spray axis speed | — | Spray axis velocities up to 500 mm/s and acceleration up to 9 m/s²[2] |
| Chuck rotation | — | Chuck rotation up to 1,000 rpm[2] |
| Dual-nozzle / single-nozzle substrate support | — | Dual-nozzle mode for Ø150 mm and Ø200 mm substrates; single-nozzle mode for Ø3", Ø100 mm, Ø150 mm and Ø200 mm substrates[2] |
| Solvent nozzle | — | Separate solvent nozzle for precise, flexible cleaning and fast recipe execution[2] |
| Heated chuck | — | Heated chuck option available[2] |
| Maximum substrate size | — | 8 inch[3] |
| Wafer sizes | — | Wafer sizes from pieces to 200mm[3] |
| Resist types | — | Common resists sprayed are SU-8, S1800 and various AZ formulations[3] |
| Topography capability | — | Capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more[3] |
| Low viscosity support | — | Low Viscosity Solutions[1] |
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