Comparison ledger
KLA 0035235-003 MMD Head, KLA 8100 XP CD-SEM, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA 8100 |
| Cited variants | — | |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[2] | 50/60 Hz[3] |
| Model | 0035235-003[2] | 8100 XP[3] |
| Make | KLA[2] | KLA[3] |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[2] | — |
| Compatible System | KLA AIT-XP[2] | — |
| Voltage | — | 102V[3] |
| Power Requirements | — | 50/60 Hz, 102V, 20 amps[3] |
| Throughput | — | Highest in the industry[1] |
| Operation | — | Fully automated cassette-to-cassette[1] |
| Measurement Capability | — | Bottom imaging of high aspect ratio structures[4] |
| Equipment type | — | Critical Dimension Scanning Electron Microscope (CD-SEM)[3] |
| Power requirement | — | 50/60 Hz - 102V - 20 amps[3] |
| Vintage | — | 2001[3] |
| Automated measurement mode | — | fully automated cassette-to-cassette CD measurements[1] |
| Target materials | — | silicon wafers and reticles[1] |
| Imaging capability | — | bottom imaging of high aspect ratio structures[1] |
| Automation and networking | — | networking capability and automation[1] |
| Productivity claim | — | highest throughput in the industry[1] |
| Applications | — | metrology requirements for CD measurements and process control[4] |
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