Comparison ledger
KLA 0035235-003 MMD Head, KLA P 11 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | P 11 SurfaceKLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA P |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Process | — | Bump[2] |
| Vertical measurement range | — | under 100 Å (0.4 min.) to approximately 300 µm (11 mils)[3] |
| Vertical resolution | — | 0.5, 2, or 10 Å[3] |
| Wafer size capability | — | Up to 8 inch / 200 mm[3] |
| Measured parameters | — | Roughness, waviness, step height, and other surface characteristics[3] |
| Programmable repeat scans | — | Up to ten times with automatic averaging[3] |
| Data visualization | — | Photo-realistic 3D rendering of scan data[3] |
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