Waferpedia

Comparison ledger

EM TIC 3 Xversus15 Lapper

KLA EM TIC 3 X, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMKLALapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA EM TIC 3 XLapmaster 15
Specifications
Wafer size8 inch[1]—
Number Of Conditioning Rings—Up to 3[2]
Ring ID—Up to 5.5″[2]
Plate Diameter – Outside—15″[2]
Plate Diameter – Inside—3 1/2″[2]
Standard RPM—60[2]
Drive Motor—1/2 HP[2]
Electrics—110V / 1Ph / 60Hz[2]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[2]
Configuration—Equipped with:[2]
Equipped with: 15″ Cast Iron Plate—Included[2]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[2]
Equipped with: (3) Conditioning Rings—Included[2]
Equipped with: (3) Hold Downs—Included[2]
Equipped with: 30 Minute Timer—Included[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing