Waferpedia

Comparison ledger

8060 Wedgeversus10100

Kulicke & Soffa 8060 Wedge, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
8060 WedgeKulicke & Soffa
10100West Bond
OEMKulicke & SoffaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1999 Vintage year of known unit · 2000 Vintage date of known unit—
Control system——
Generation——
FamilyKulicke & Soffa 8060 WedgeWest Bond 10100
Specifications
Bonding TypeWedge[1]—
Automation LevelAutomatic[2]—
Wire MaterialsGold, Aluminum[2]—
Wafer Size200 mm[2]—
ManufacturerKulicke & Soffa[1]—
Model8060 Wedge[3]—
CategoryPackaging & Bonding[1]—
Machine typePackaging and bonding machine[1]—
Bonder typeAutomatic gold and aluminum wedge bonder[2]—
Vintage year1999[4]—
Vintage date2000-09-01[2]—
Software VersionP805747[4]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]Equipment inventory listing
  4. [4]lislesurplus.comlislesurplus.com