Comparison ledger
Lam Research 2300 Exelan Flex, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 Exelan FlexLam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Oxford Instruments 100 ICP Fluorine |
| Specifications | ||
| Voltage | 208 VAC[1] | — |
| Configuration | 50/60 Hz[1] | — |
| Full Load Current | 56 A[1] | — |
| Main CB Current Rating | 70 A[1] | — |
| Wafer Size | 12 inch (300 mm)[2] | — |
| Frequency | 50/60 Hz[1] | — |
| Make | Lam[2] | — |
| Model | 2300 Exelan Flex[2] | — |
| Wafer Sizes | 12 inch[2] | — |
| Equipment type | Etch Chamber[2] | — |
| Power | 208 VAC, 50/60 Hz[1] | — |
| Vintage | 2006[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[4] |
| Cryo DRIE etch rate | — | up to 5 µm/min[4] |
| Wafer size | — | 4 inch, 6 inch, 8 inch (with clamp change)[4] |
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