Comparison ledger
Lapmaster 12 Lapper, Logitech EP1, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | EP1Logitech |
|---|---|---|
| OEM | Lapmaster | Logitech |
| Category | CMP | CMP |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Logitech EP1 |
| Specifications | ||
| Outside plate diameter | 12 inches[1] | — |
| Lapping Speed Range | 0 to 60 rpm[2] | — |
| Wafer Size Compatibility | 4 inches or smaller[1] | — |
| Input Voltage | 110 V[1] | — |
| Frequency | 60 Hz[1] | — |
| Phase | 1[1] | — |
| Number of Rings | 3[1] | — |
| Number of Weights | 3[1] | — |
| Includes Slurry System | Yes[1] | — |
| Includes Timer | Yes[1] | — |
| Product family | — | EP Polishing Pads and Cloths[3] |
| Application type | — | Chemical Mechanical Polishing (CMP)[3] |
| Suitable applications | — | oxide, nitride and copper[3] |
| Type | — | Chemical Mechanical Polishing (CMP) cloths and pads[3] |
| Suitable materials | — | Oxide, nitride and copper[3] |
| Product type | — | Chemical Mechanical Polishing (CMP) polishing cloths and pads[3] |
| Applications | — | oxide, nitride, and copper[3] |
| Associated wafer process capacity | — | up to 100mm/4"[4] |