Comparison ledger
Lapmaster 120 Continuous, Strasbaugh 6 EC, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 120 ContinuousLapmaster | 6 ECStrasbaugh |
|---|---|---|
| OEM | Lapmaster | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 120 Continuous | Strasbaugh 6 EC |
| Specifications | ||
| Configuration | — | 50/60 Hz[1] |
| Phase | — | 3 Phase[1] |
| Voltage | — | 208 V[1] |
| Full Load | — | 30 A[1] |
| Wafer size (inch) | — | 3, 4[2] |
| Wafer size (mm) | — | 100[3] |
| Input voltage | — | 208 V[1] |
| Frequency | — | 50/60 Hz[1] |
| Full load current | — | 30 A[1] |
| Motor amps | — | 13.6 A[1] |
| Conditioning arm sweep zones | — | 10[4] |
| Pad conditioning zones | — | 20[5] |
| Control interface | — | Color touch-screen GUI[5] |
| Carrier type | — | ViPRR[5] |
| Load station | — | Hydro-Lift[5] |
| Table and spindle motor control | — | Closed-loop RPM[5] |
| Pad conditioning type | — | In-situ and ex-situ[5] |
| Typical applications | — | Si and SiO2 polishing and planarizing[3] |
| Asset / model | — | Strasbaugh 6 EC[1] |
| Power | — | 50/60 Hz, 3 phase, 208 V[1] |
| Motor current | — | 13.6 motor amps[1] |
| Wafer size | — | 100 mm[3] |
| Substrate chucks | — | 3-inch and 4-inch wafers[2] |
| Functions | — | Si and SiO2 polishing and planarizing[3] |
| Programmable controls | — | fully programmable sweep, downpressure, table speed, time, slurry flow[2] |