Waferpedia

Comparison ledger

15versus15 Lapperversus15 PB Diamond

Lapmaster 15, Lapmaster 15 Lapper, Lapmaster 15 PB Diamond, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
15 LapperLapmaster
15 PB DiamondLapmaster
OEMLapmasterLapmasterLapmaster
CategoryDicing & GrindingCMPCMP
Wafer size———
Process node———
Introduced———
Production run———
Lifecycle———
Lifecycle milestones———
Control system———
Generation———
FamilyLapmaster 15Lapmaster 15Lapmaster 15
Specifications
Input Power110 Vac[1]—110 volts[4]
Plate Diameter15 inches (381 mm)[2]——
Number of Conditioning Rings3[2]——
Ring ID5.5 inches (140 mm)[2]Up to 5.5″[3]—
Standard RPM60[2]60[3]—
RPM Range (Variable Speed Drive)0-60[2]——
Drive Motor - Lapper0.5 HP (0.37 kW)[2]——
Drive Motor - Polisher0.75 HP (0.56 kW)[2]——
Length25 inches (635 mm)[2]——
Width20 inches (508 mm)[2]——
Height24 inches (610 mm)[2]——
Estimated Shipping Weight285 lbs (129.3 kg)[2]——
Number Of Conditioning Rings—Up to 3[3]—
Plate Diameter – Outside—15″[3]—
Plate Diameter – Inside—3 1/2″[3]—
Drive Motor—1/2 HP[3]—
Electrics—110V / 1Ph / 60Hz[3]—
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[3]—
Configuration—Equipped with:[3]Multi-station[4]
Equipped with: 15″ Cast Iron Plate—Included[3]—
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[3]—
Equipped with: (3) Conditioning Rings—Included[3]—
Equipped with: (3) Hold Downs—Included[3]—
Equipped with: 30 Minute Timer—Included[3]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing
  4. [4]inventory listing