Waferpedia

Comparison ledger

Lz-23versusWS-650-23

Laurell Lz-23, Laurell WS-650-23, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Lz-23Laurell
WS-650-23Laurell
OEMLaurellLaurell
CategorySpin coaterSpin coater
Wafer size150mm150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLaurell Lz-23Laurell WS-650-23
Cited variants
Specifications
Series650-series[1]—
Maximum wafer sizeUp to 150 mm wafers[1]—
Substrate size5 in × 5 in (127 mm × 127 mm)[1]—
Maximum rotational speed12,000 RPM (based on a 100 mm silicon wafer)[1]12,000 RPM (based on a ø 100 mm silicon wafer)[2]
Process controller650-series process controller[1]—
Power95 to 240 VAC, 47/63 Hz, approximately 300 W[1]95 to 240VAC, 47/63HZ, ~300 Watts[2]
Nitrogen/CDA process/seal purge60–70 PSIG (4–5 bar)[1]—
Vacuum suggestion25–28 inches Hg with a flow volume of 4.5 SCFM at 0 inches Hg[1]—
Model—WS-650-23 B Spin Coater[2]
Mounting—Station Mounted[2]
Wafer capacity—Up to ø 150 mm wafers[2]
Substrate capacity—5" × 5" (127 mm × 127 mm) substrates[2]
Required N2 process/seal purge—60–70 PSIG (4–5 bar) of Nitrogen/CDA[2]
Vacuum—25–28 inches Hg; suggested flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[2]
Processes supported—Coating, Etching, Developing, Rinsing-Drying and Cleaning[2]
Maximum substrate size—150 mm wafers, 5" × 5" (127 mm × 127 mm) substrates[2]
Vacuum requirement—25–28 inches Hg (~635–711 mm Hg) with a flow volume of 4.5 SCFM (0.127 m³/min) at 0 inches Hg[2]
Seal/process purge gas—N₂ at 60–70 PSIG (4–5 bar)[2]
Gas consumption (standard motor)—3 cubic feet per hour (0.085 m³/hour)[2]
Gas consumption (high-performance motor)—20 cubic feet per hour (0.566 m³/hour)[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org