Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, Shinkawa 8-inch, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 8-inchShinkawa |
|---|---|---|
| OEM | Logitech | Shinkawa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 8-inch |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | Shinkawa 8-inch |
| Cited variants | — |
|
| Specifications | ||
| Wafer Size | 6 inch[2] | — |
| Application | — | Mold CSP, Wafer Level CSP[1] |
| Function | — | Package sorter for diced solid mold CSP and wafer level CSP[1] |
| Sorting method | — | Diced packages attached on tape are sorted very quickly in a tray[1] |
| Flip mechanism | — | Available with a flip mechanism that attaches the ball upside down for live-bug style[1] |
| Sorting speed | — | 0.5 s/package[1] |
| Inline processing | — | In-line processing with dicer (option)[1] |
| Variant | — | DPS-260, unloader added version also available[1] |
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