Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, Sumitomo SE 75 DU Horizontal Injection, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | SE 75 DU Horizontal InjectionSumitomo |
|---|---|---|
| OEM | Logitech | Sumitomo |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | Sumitomo SE 75 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Phase | — | 3 Phase[2] |
| Configuration | — | AC200V, 50/60 Hz[2] |
| Clamp force | — | 75 Ton[3] |
| Power input | — | AC200V, 50/60 Hz[2] |
| Power input (alternate) | — | AC220V, 60 Hz[2] |
| Inverter current | — | 21.7A[4] |
| Heater power | — | 6.6KW[4] |
| Injection unit | — | C110[3] |
| Screw diameter | — | 25 mm[3] |
| Shot size | — | 1.7 oz[3] |
| Max injection pressure | — | 30,780 psi[3] |
| Tie bar spacing | — | 14.17" x 16.14"[3] |
| Mold open stroke (max) | — | 11.81"[3] |
| Platen daylight (max) | — | 27.95"[3] |
| Mold mounting height (min) | — | 6.30"[3] |
| Vintage | — | 2006[4] |
| Electrical phase | — | 3 Phase[4] |
| Voltage options | — | AC200V, 50/60 Hz; AC220V, 60 Hz[4] |
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