Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7476E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7476EWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7476E |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 7476E[2] |
| Instrument type | — | West Bond Wedge-Wedge Gold Wire Bonder[2] |
| Description | — | Two-way convertible wedge-to-wedge ultrasonic bonder[3] |
| Purpose | — | Used for making electrical contacts between semiconductor dies and packages[4] |
| Bonding technique | — | Wedge-wedge technique using ultrasonic energy[3] |
| Bonding orientations stated | — | 45° wedge bonding; 90° wedge bonding (deep access)[4] |
| Compatible wire materials stated | — | Aluminum or gold wires[3] |
| Wire diameter range stated | — | 0.0007 in. to 0.002 in.[3] |
| Ribbon diameter range stated | — | 0.001 in. to 0.010 in.[3] |
| Default wire | — | 0.001 in. diameter aluminum wire[3] |
| Ultrasonic transducer | — | 4 W, 63 kHz[4] |
| Manual control | — | Manual control via 8:1 reduction ratio micromanipulator arm[4] |
| Sample holder size | — | Up to around 30 mm x 30 mm[3] |
| Wedge angle configurations | — | 45° and 90° (deep access) wedge bonding[4] |
| Wire diameter compatibility | — | Au or Al wires with 25 μm (0.001") diameter[4] |
| Wire size range (thermosonic) | — | Al and Au wires from 0.7 mil to 2 mil in diameter[4] |
| Operator interface | — | Manual control via 8:1 reduction ratio micromanipulator arm[4] |
| Wire feeding | — | Wire clamped and threaded diagonally under the bonding wedge, requiring front-to-back bonding direction[3] |
| Programmable features | — | Dual force (high or low), pure vertical Z, pneumatic braking of all axes during bonding, and radiant tool heat[3] |
| Standard bonding method | — | 45° wire feed, clamps behind the tool, traditional wedge-wedge[3] |
| ESD protection | — | Electroless nickel plating on exposed tool assemblies and other moving parts; powder-coated paint that is dissipative on exposed painted parts[3] |
| Default wire diameter | — | 0.001 in. diameter wire[3] |
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