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Comparison ledger

800 Plus RIEversus1512e

Oxford Instruments 800 Plus RIE, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
800 Plus RIEOxford Instruments
1512eTegal
OEMOxford InstrumentsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments Plasmalab 800Tegal 1512e
Specifications
Configurationmay have missing parts[1]—
Process typeReactive I on Etching (RIE)[2]—
Wafer size5 inch[1]—
Control systemPC controller[2]—
FootprintAll electronics and vacuum components located within tool body to minimize footprint[2]—
RF supplyAdvanced Energy RFX 600A[2]—
Tur bpumpLeybold TMP-361C[2]—
Tur bpump controllerLeybold Harris Turbotronik NT20[2]—
Vacuum pumpBusch Cobra BA100[2]—
Elecrical supply208 VAC, 3 Phase[3]—
Included subsystemsProcess chamber, gas-delivery and control enclosure, cooling and shutter controls, pumping/control computer[3]—
Tool type—Industrial RIE plasma etcher system[4]
Stated configuration—With modules assembly for CI-4222[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]exapro.comexapro.com
  4. [4]semistarcorp.comsemistarcorp.com