Comparison ledger
Pfeiffer ACP28G, STS 310, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACP28GPfeiffer | 310STS |
|---|---|---|
| OEM | Pfeiffer | STS |
| Category | Deposition | Deposition |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Pfeiffer ACP28G | STS 310 |
| Specifications | ||
| Pump type | Dry pump[1] | — |
| Role | Loadlock primary pump[1] | — |
| Manufacturer | Pfeiffer[1] | — |
| Contextual system | EVA 451 evaporator[1] | — |
| Intended application | Pumping traces of corrosive gas[2] | — |
| Pumping mechanism | Frictionless multi-stage roots design[2] | — |
| Voltage range | 90 to 254 VAC at 50 or 60 Hz[2] | — |
| Overhaul interval | 22,000 hours[2] | — |
| Tool type | — | plasma-enhanced chemical-vapor-deposition (PECVD) system[3] |
| Wafer size | — | 100-mm-diameter silicon wafers[3] |
| Deposition material | — | silicon dioxide[3] |
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