Waferpedia

Comparison ledger

Opus 3 SLTversus1070

Semics Opus 3 SLT, Signatone 1070, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1070Signatone
OEMSemicsSignatone
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySemics Opus 3 SLTSignatone 1070
Specifications
TypeAutomatic[1]—
Accuracy1.5 µm[1]—
Chuck size175 x 200 mm[1]—
Operating temperature-40 to 200 °C[1]—
Probing force230 kgf[1]—
Overall dimensions1485 x 1720 x 960 mm[1]—
Wafer size8 inches, 12 inches[1]—
Test temperature range-55 °C to 200 °C[2]—
Test temperature accuracy±1 °C[2]—
Chuck load capacity200 kg[2]—
Wafer Sizes Supported8 inches, 12 inches[2]—
Test Temperature Range (Alternative)-40 °C to 200 °C[1]—
System Overall Accuracy±1.5 µm[2]—
System Overall Accuracy (Alternative)1.5 µm[1]—
Chuck Flatnesswithin 15 µm[2]—
Die Size Range0.2 mm to 100 mm[2]—
Acceptable Wafer Bow2 mm for 8-inch and 12-inch wafers[2]—
MTBF> 180 hours[2]—
OCR Image Recognition and Auto Needle AlignmentYes (upward-looking camera, fully automatic)[2]—
GPIB CommunicationYes[2]—
Mapping Format CompatibilityTSK, TEL, OPUS[2]—
Cleaning ModesCLEAN PAD (100 mm x 200 mm), CLEAN WAFER (8 & 12 inch)[2]—
Remote ControlTeamViewer, VNC[2]—
ManufacturerSemics Inc.[2]—
ModelOpus 3 SLT[3]1070[4]
Operating Temperature-40 to 200 Degree C[1]—
Equipment Name高低温全自动探针台-Opus 3 SLT[2]—
Instrument Number22007413[2]—
OriginKorea[2]—
Temperature Range-55℃~200℃[2]—
Temperature Accuracy±1℃[2]—
System Accuracy±1.5 um[2]—
Make—Signatone[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]semiconductor.directorysemiconductor.directory
  2. [2]antpedia.comantpedia.com
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing