Comparison ledger
SUSS MicroTec 150 e Mask, SUSS MicroTec MA6/MA4, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 150 e MaskSUSS MicroTec | MA6/MA4SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | wafers up to 4″ (MA4) or 6″ (MA6); also 1 cm² pieces |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec 150 e Mask | SUSS MicroTec MA6/MA4 |
| Cited variants | — | |
| Specifications | ||
| Exposure resolution | — | < 1 µm[1] |
| Alignment accuracy | — | Topside – 500 nm[1] |
| Exposure modes | — | Hard contact, soft contact, proximity, flood[1] |
| Spectral range | — | 365 nm – 405 nm[1] |
| Substrate accommodation | — | 1 cm² pieces and wafers up to 4″ (MA4) or 6″ (MA6)[1] |
| Uniformity | — | +/- 5% over exposure area[1] |
| Image capture | — | CCD camera and monitor[1] |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →