Comparison ledger
SUSS MicroTec ACS 200 +, Tokyo Electron Lithius Pro, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 200 +SUSS MicroTec | Lithius ProTokyo Electron |
|---|---|---|
| OEM | SUSS MicroTec | Tokyo Electron |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2025 Announcement of LITHIUS Pro DICE |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ACS 200 | Tokyo Electron Lithius |
| Cited variants |
| |
| Specifications | ||
| Voltage | 400 V[2] | — |
| Phase | 3 Phase[2] | — |
| Frequency | 60 Hz[2] | — |
| Configuration | With Gencobot 7S / 3L Transfer Robot[2] | Immersion COT and DEV[5] |
| OEM | SUSS MicroTec[2] | — |
| Model | ACS 200 +[2] | — |
| Wafer Sizes | 6 inch[2] | — |
| Vintage | 2007[2] | — |
| Transfer Robot | Gencobot 7S / 3L[2] | — |
| Developer Module | nDeveloper Module[2] | — |
| Solvent Developer Module | Yes[2] | — |
| Coater Module | Yes[2] | — |
| Thermal Module | 2 hotplates, 1 chillplate[2] | — |
| Controller | Kontron[2] | — |
| Media Storage Tanks | 4[2] | — |
| Media Control Box | SUSS[2] | — |
| Recirculating Chillers | Julabo F30-CL (2), Julabo FC 600 S (2)[2] | — |
| Power Requirements | 400 V, 3 Phase, 60 Hz[2] | — |
| Manufacturer | SUSS[2] | — |
| Equipment type | Coater / Developer[2] | Coater / Developer[5] |
| Developer module type | Solvent developer module[2] | — |
| Coater module | Coater module[2] | — |
| Thermal module | Thermal module with 2 hotplates (1 ea chillplate)[2] | — |
| Process description | — | Immersion COT and DEV[5] |
| Pre-/post-exposure process | — | With rinse process at pre-/post exposure[5] |
| FOUP exchanger | — | 1 FOUP exchanger[5] |
| Application | — | Lithography process (ArF Immersion, ArF, KrF, i-line)[3] |
| Throughput | — | Maximum 250 wph capable in future; 200 wph capability with future upgradeability to 250 wph[3] |
| Integration | — | Optimized integration with the exposure tool for maximizing litho cell throughput[3] |
| Chemical consumption | — | Drastically reduced chemical consumption[3] |
| Wafer Size | — | 300mm[4] |
| Throughput (LITHIUS Pro V) | — | 200 wph (upgradeable to 250 wph)[3] |
| Applications | — | ArF Immersion, ArF, KrF, i-line lithography[3] |
| Date of Manufacture (example unit) | — | 2010-04-15[6] |
| Software Version (example unit) | — | 300.0.88.3[6] |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →