Comparison ledger
SUSS MicroTec AS8 / 12, SUSS MicroTec ELP300 Gen2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AS8 / 12SUSS MicroTec | ELP300 Gen2SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | — | — |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | Gen2 |
| Family | SUSS MicroTec AS8 / 12 | SUSS MicroTec ELP300 Gen2 |
| Specifications | ||
| Operation | Manual[1] | — |
| Wafer Size | up to 300 mm[1] | up to 300 mm[1] |
| Process | Spray Coating[1] | — |
| Automation | — | Automated[1] |
| Laser Type | — | Excimer Laser[1] |
| Processes | — | Alignment, Ablation, Laser-Assisted Debonding, Laser Seed Layer Removal[1] |