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Comparison ledger

1512eversusTE 8500 P Dry

Tegal 1512e, Tokyo Electron TE 8500 P Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
TE 8500 P DryTokyo Electron
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1512eTokyo Electron TE 8500
Specifications
Tool typeIndustrial RIE plasma etcher system[1]—
Stated configurationWith modules assembly for CI-4222[1]—
Configuration—1 chamber[2]
Gas—CF4, CHF3, He[2]
Wafer size—6 inch[3]
Chamber count—1[2]
Application—Oxide etch with endpoint[2]
Process gases—CF4, CHF3, He[2]
Operating system—EPROM based[2]
Pump—2ea, Kashiyama[2]
Vintage (reported)—1996 (some units 1999)[3]
Etch Type—Oxide etch with end point[2]
Gases—CF4, CHF3, He[2]
Operating System—EPROM based system[2]
Pump Make—Kashiyama (2 units)[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]inventory listing
  3. [3]Equipment inventory listing