Waferpedia

Comparison ledger

10100versus7700A

West Bond 10100, West Bond 7700A, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
7700AWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10100West Bond 7700A
Cited variants—
  • West-Bond 7700A Hydrogen Flame Off Ultrasonic Ball-Wedge Bonder[1]
  • West-Bond 7700A Manual Ball Bonder[1]
  • West-Bond 7700A Manual Thermosonic Gold Ball Wire Bonder[1]
  • West-Bond 7700A Ultrasonic Gold Ball & Wedge Wire Bonder[1]
Specifications
Bonding type—Ultrasonic ball & wedge wire bonder[1]
Configuration—Manual ball bonder[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com