Waferpedia

Comparison ledger

PG 300 RM Backversus15

Accretech PG 300 RM Back, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMAccretechLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech PG 300 RM BackLapmaster 15
Specifications
Equipment typeBack grinder[1]—
Input Power—110 Vac[2]
Plate Diameter—15 inches (381 mm)[3]
Number of Conditioning Rings—3[3]
Ring ID—5.5 inches (140 mm)[3]
Standard RPM—60[3]
RPM Range (Variable Speed Drive)—0-60[3]
Drive Motor - Lapper—0.5 HP (0.37 kW)[3]
Drive Motor - Polisher—0.75 HP (0.56 kW)[3]
Length—25 inches (635 mm)[3]
Width—20 inches (508 mm)[3]
Height—24 inches (610 mm)[3]
Estimated Shipping Weight—285 lbs (129.3 kg)[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org