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Comparison ledger

SS 20 Automatic Dicingversus15

Accretech SS 20 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMAccretechLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech SS 20 Automatic DicingLapmaster 15
Cited variants—
Specifications
Max workpiece size (round wafers)250 mm[2]—
Max workpiece size (square wafers)250 mm[2]—
Spindle speed (standard)60,000 rpm[2]—
Spindle speed (optional)80,000 rpm[2]—
Display17-inch touchscreen[2]—
Kerf check functionYes[2]—
Maximum wafer diameter (circular)250 mm[2]—
Maximum square wafer size250 mm x 250 mm[2]—
Maximum sample thickness (tape-mounted)1 mm[3]—
Compatible wafer sizes (reported at one facility)up to 8 inches (200 mm) diameter[3]—
Input Power—110 Vac[4]
Plate Diameter—15 inches (381 mm)[5]
Number of Conditioning Rings—3[5]
Ring ID—5.5 inches (140 mm)[5]
Standard RPM—60[5]
RPM Range (Variable Speed Drive)—0-60[5]
Drive Motor - Lapper—0.5 HP (0.37 kW)[5]
Drive Motor - Polisher—0.75 HP (0.56 kW)[5]
Length—25 inches (635 mm)[5]
Width—20 inches (508 mm)[5]
Height—24 inches (610 mm)[5]
Estimated Shipping Weight—285 lbs (129.3 kg)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]accretech.euaccretech.eu
  2. [2]accretech.euaccretech.eu
  3. [3]purdue.atlassian.netpurdue.atlassian.net
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org