Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Esec 2007 SSI Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | 2007 SSI PlusEsec |
|---|---|---|
| OEM | Applied Materials | Esec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Esec 2007 |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | For Parts[5] |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | Soft solder die bonding[6] |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Asset Number | — | 82246[5] |
| Last Confirm Date | — | August 02, 2024[5] |
| Automation | — | Fully automated[6] |
| Product line | — | Soft solder die bonder[6] |
| Series | — | 2007 SSI series[7] |