Comparison ledger
Applied Materials 0010-13622 RF Match for, Temescal BJD 1800 Thermal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | BJD 1800 ThermalTemescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Temescal BJD 1800 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | External power suppy integrated into unit to improve the deposition to less than 1A/s (2025)[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| System type | — | Thermal evaporation evaporator[2] |
| Chamber type | — | Low-profile bell jar[3] |
| Chamber size | — | 18-inch (457 mm) or 20-inch (508 mm)[3] |
| Deposition rate | — | Less than 1 Å/s (with integrated external power supply)[2] |
| Carousel pockets | — | 4[2] |
| Control sweep | — | Inficon (installed 2023)[2] |
| Power supply | — | External power supply integrated into unit[2] |
| Evaporation sources | — | 2 thermal sources (configurable)[3] |
| Cryopump | — | Standard configuration[3] |
| Substrate fixturing | — | 3 planet deposition fixturing[4] |
| Co-deposition capability | — | Dual source co-deposition[4] |
| Deposition controller | — | Sigma Dual Deposition Controller[4] |
| Vintage of documented unit | — | 1991[2] |
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