Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, KLA Surfscan 6220, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | KLA Surfscan 6220 |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | Single Phase[2] |
| Frequency | — | 60 Hz[2] |
| Voltage | — | 208 V[2] |
| Equipment type | — | Bare wafer surface defect inspection system / Particle inspection system[3] |
| Substrate sizes (inch) | — | 2", 3", 4", 6", 8"[3] |
| Substrate sizes (metric) | — | 100 mm, 125 mm, 150 mm, 200 mm (round or rectangular)[4] |
| Wafer thickness | — | SEMI Standard Wafer Thickness[3] |
| Material compatibility | — | Any opaque, polished surface which scatters less than 5 percent of incident light[3] |
| Defect sensitivity (most surfaces) | — | Better than 0.20 µm @ 95% capture rate[4] |
| Defect sensitivity (polished surfaces) | — | Better than 0.10 µm @ 95% capture rate[4] |
| Defect sensitivity (bare silicon) | — | 0.12 µm[4] |
| Defect sensitivity (PSL sphere equivalent) | — | 0.09 µm diameter @ >80% capture rate (0.112 µm @ 90%)[3] |
| Count repeatability | — | Error less than 0.5% at 1 standard deviation (mean count >500, 0.364 mm dia. latex spheres)[3] |
| Count repeatability (alternate) | — | Less than 1.0% at 1 standard deviation (mean count >500, 0.204 µm diameter latex spheres on bare silicon)[4] |
| Count accuracy | — | Better than 99% (verified with VLSI Standards’ Relative Standard)[3] |
| Throughput | — | 100 wph (200 mm) at 0.12 µm[3] |
| Contamination | — | Less than 0.005 particles/cm² >0.15 µm diameter per single pass[3] |
| Contamination (alternate) | — | Less than 0.005 particles/cm >0.15 µm[4] |
| Haze sensitivity | — | 0.02 ppm[4] |
| Illumination source | — | 30 mW Argon-Ion laser, 488 nm wavelength[3] |
| Spatial resolution | — | 50 µm[4] |
| Signal integration | — | 2D signal integration[4] |
| Wafer handling | — | Single puck wafer handling from two cassettes (one sender/receiver, one receiver); non-contaminating robotic handler[3] |
| Wafer handling (alternate) | — | Non-contaminating robotic handler; random access sender/receiver unit[4] |
| Operator interface | — | Mouse and/or dedicated user keypad[3] |
| Electrical requirements | — | Single phase, 60 Hz, 17 A, 208 V[2] |
| OEM | — | KLA[2] |
| Model | — | Surfscan 6220[2] |
| Product type | — | Wafer Particle Detection System[5] |
| Wafer sizes | — | 2", 3", 4", 6", and 8" wafers[3] |
| Substrate sizes | — | 100, 125, 150, and 200 mm (round or rectangular substrates)[4] |
| Sensitivity | — | 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate[3] |
| Repeatability | — | Count repeatability error less than 0.5 percent at 1 standard deviation[3] |
| Accuracy | — | Count accuracy better than 99 percent[3] |
| Cassette handling | — | Single puck wafer handling from two cassettes (one sender/receiver, one receiver)[3] |
| Vintage | — | 1996[2] |
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