Waferpedia

Comparison ledger

0010 47763versus2300 Flex 45

Applied Materials 0010 47763, Lam Research 2300 Flex 45, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
2300 Flex 45Lam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Lam Research 2300
Specifications
Configuration2nd Source New[1]Metal HP MWS[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]2300 Flex 45[4]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
3 Chambers—Insulating Film / Metal / Ashing[4]
Make—Lam[4]
Equipment type—Etcher[4]
Chambers—3 chambers[4]
Process coverage—Insulating film / Metal / Ashing[4]
Gases used for insulating film—C4F8, CF4, CH3F[4]
Gases used for metal—Cl2, BCl3[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]inventory listing