Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, F&K Delvotec G 5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | G 5F&K Delvotec |
|---|---|---|
| OEM | Applied Materials | F&K Delvotec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | F&K Delvotec G 5 |
| Specifications | ||
| Configuration | — | 45° or 90° Bondhead[1] |
| Equipment type | — | Wire bonder[1] |
| Bondhead | — | 45° or 90° bondhead[1] |
| Condition | — | Refurbished[1] |
| Vintage | — | 2014[1] |
| Wire diameter | — | 25 µm wire[2] |
| Bondhead type | — | Ball/wedge bondhead[2] |
| Power | — | 100-120 / 200-240 V, 0.6 kVA[2] |
| Phase | — | 50/60 Hz, Phase 5, 2.5 A[2] |
| Transducer | — | 120 kHz[2] |
| Vacuum | — | Vacuum based[2] |
| Minimum pad size | — | PCB 70 µm minimum pad size[2] |
| Angle | — | 90 degrees[2] |
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