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Comparison ledger

Centura 5200 MetalversusConcept Three Speed

Applied Materials Centura 5200 Metal, Lam Research Concept Three Speed, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Deposition, null[1]
Side-by-side comparison of selected equipment models
Attribute
Centura 5200 MetalApplied Materials
OEMApplied MaterialsLam Research
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura 5200Lam Research Concept Three
Cited variants—
  • Triple Speed NF[2]
Specifications
ConfigurationTi/TiN MCVD[1]Triple Speed NF[2]
ProcessCVD (Chemical Vapor Deposition)[1]CVD (Chemical Vapor Deposition)[4]
Wafer size8 inch[1]—
Process chambersChamber A – MCVD TiN; Chamber B – MCVD TiN; Chamber C – MCVD Ti; Chamber D – MCVD Ti[1]—
Ti/TiN MCVD1[3]—
Speed Handler Type—WTS IMM[2]
Primary User Interface—Flat Panel Right[2]
WTS Vacuum PEC Location—Port 5[2]
Module A Location—Port 2[2]
Module B Location—Port 3[2]
Module C Location—Port 4[2]
Handler Facilities—Bottom[2]
Interconnect Cable—Length 75 Feet[2]
Software Version—5.73[2]
Software Build—78[2]
Operating System—Windows XP/2000[2]
User Interface Type—Ballroom[2]
Signal Tower Operation—3 Color Light Tower(RYG)[2]
FOUP ID Reader Type—OMRON[2]
ATM Robot End Effector—Vacuum[2]
OEM—Lam / Novellus[4]
Model—Concept Three Speed[4]
Wafer Size—12 inch[4]
Vintage—2005[4]
Interconnect Cable Length—75 Feet[2]
Front End Robot Type—Brooks ATR 8[2]
TM Robot Type—Brooks Mag 7[2]
IMM Readiness Option—No[2]
FA Communication Interface—No[2]
Handler Leak Check Shut Off Valve—No[2]
Make—Lam / Novellus[4]
Equipment type—CVD (Chemical Vapor Deposition)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing