Comparison ledger
Applied Materials Mirra Mesa, SUSS MicroTec PA 300 Control, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mirra MesaApplied Materials | PA 300 ControlSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra Mesa | SUSS MicroTec PA 300 |
| Cited variants |
| — |
| Specifications | ||
| CMP Model | Mirra Mesa[3] | — |
| Process | OX[3] | — |
| Polisher System Module | 4 Head 3 Platen[3] | — |
| Configuration | Platen 1 configuration:[3] | 500 VA, 115V, 60Hz[4] |
| Platen 1 Type | With window, belt + gear CVT[3] | — |
| Platen 1 endpoint | Full scan and motor torque[3] | — |
| Platen 1 slurry arm | Standard tunable[3] | — |
| Platen 1 pad conditioner arm | Standard[3] | — |
| Platen 2 Type | With window, belt + gear CVT[3] | — |
| Platen 2 endpoint | Full scan[3] | — |
| Platen 2 slurry arm | Standard tunable[3] | — |
| Platen 2 pad conditioner arm | Standard[3] | — |
| Platen 3 Type | With window, belt + gear CVT[3] | — |
| Platen 3 endpoint | Full scan[3] | — |
| Platen 3 slurry arm | Standard tunable[3] | — |
| Platen 3 pad conditioner arm | Standard[3] | — |
| Polishing head | 3 zone[3] | — |
| Slurry Delivery | 2 types of slurry[3] | — |
| Model | Mirra Mesa[3] | — |
| Category | CMP (Chemical Mechanical Polisher)[3] | CMP[1] |
| Slurry flow rate control | Peristaltic pump[3] | — |
| FABs port | 3 Port[3] | — |
| Electrical requirements | 50/60 HZ; 200-230V; three-phase four-wire[3] | — |
| Cleaner quantity | 1 unit[3] | — |
| Cleaner robot | working beam Megasonics Module[3] | — |
| Cleaning method | Vertical[3] | — |
| Megasonics delivery type | 2 Chem flow meter type[3] | — |
| Brush 1 clean | 1 Chem and DIW[3] | — |
| Brush 1 flow type | flow meter type[3] | — |
| Brush 2 clean | 1 Chem and DIW[3] | — |
| Brush 2 flow rate | flow meter type[3] | — |
| Dry type | Spin Dryer[3] | — |
| Drying | Lamp heater Drying; N2 Drying[3] | — |
| Line Frequency | 50/60 HZ[3] | — |
| OEM | Applied Materials[3] | — |
| Facilities option | EMO Guard Ring[3] | — |
| Line voltage | 200-230V[3] | — |
| Connection | Three-phase four-wire[3] | — |
| Power lamp | Green Lamp[3] | — |
| Power connected lamp | Power Connected Lamp[3] | — |
| GFI type | STANDARD 30mA[3] | — |
| Power | — | 500 VA, 115V, 60Hz[4] |
| Wafer handling | — | 12" Nickel Plated Aluminum Chuck[4] |
| Control & software | — | ATT M300 Temp Control Unit[1] |
| Optics | — | 10X, 2X Mitutoyo Plan Apo Objective, 2ea[4] |
| Configuration & options | — | Cascade CMPS-888 Microscope; Suss PH150 Micropositioner, 4ea[4] |
| Chuck | — | 12-inch nickel plated aluminum chuck[4] |
| Control unit | — | ATT M300 Temp Control Unit[1] |
| Microscope | — | Cascade CMPS-888 Microscope[4] |
| Micropositioners | — | Suss PH150 Micropositioner, 4ea[4] |