Comparison ledger
Applied Materials Reflexion, Applied Materials Reflexion 3600, Applied Materials Reflexion LK, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ReflexionApplied Materials | Reflexion 3600Applied Materials | Reflexion LKApplied Materials |
|---|---|---|---|
| OEM | Applied Materials | Applied Materials | Applied Materials |
| Category | CMP | CMP | CMP |
| Wafer size | — | — | — |
| Process node | — | — | — |
| Introduced | — | — | — |
| Production run | — | — | — |
| Lifecycle | — | — | — |
| Lifecycle milestones | — | — | — |
| Control system | — | — | — |
| Generation | — | — | — |
| Family | Applied Materials Reflexion | Applied Materials Reflexion | Applied Materials Reflexion |
| Cited variants | — | — | |
| Specifications | |||
| Configuration | Dielectric, LK Oxide[2] | SW version:[5] | Miniship[6] |
| Wafer Sizes | 12 inch[2] | — | — |
| Process Type | Chemical Mechanical Polishing (CMP)[2] | — | — |
| OEM | Applied Materials[2] | — | — |
| Model | Reflexion[2] | Reflexion 3600[5] | — |
| Category | CMP (Chemical Mechanical Polisher)[2] | CMP (Chemical Mechanical Polisher)[5] | — |
| Wafer Size | 12 inch[2] | — | — |
| CE Segregation (NonCu/Open/Cu) | — | Cu[5] | — |
| Reflexion Software | — | PB59M3i2[5] | — |
| MESA software | — | CB22M3i2[5] | — |
| ISRM software | — | IB11g5b[5] | — |
| FI robot type / controller | — | Kawasaki[5] | — |
| Load port | — | TDK TAS 300 (2)[5] | — |
| FI controller | — | AMAT VMICPCI-7326[5] | — |
| Wet robot type | — | Yaskawa WTM511-2-FWS02-V1-CU/0190-08246 (1)[5] | — |
| Polisher MEI B/D | — | AMAT 0100-00722 (3)[5] | — |
| Polisher AIO B/D | — | AMAT 0100-00396 (2)[5] | — |
| Polisher DIO B/D | — | AMAT 0100-01995 (7)[5] | — |
| Platen Driver | — | Yaskawa SGDH-75 AE (3)[5] | — |
| Cross Driver | — | Yaskawa SGDH-08 AE-S (1)[5] | — |
| Pad Conditioner/HCLU Driver | — | Yaskawa SGDH-01 AE (7)[5] | — |
| Head SWEEP Driver | — | Yaskawa SGDH-04 AE (4)[5] | — |
| Head Rotation Driver | — | SE 2 VOSTARCD CR 06250 (4)[5] | — |
| Meg Generator | — | Kaijo 600 (1)[5] | — |
| Mega Heater | — | Orion ETD 232-SA-A-UL (1)[5] | — |
| Slurry arm Type | — | AMAT 0040-78378 (3)[5] | — |
| Make | — | Applied Materials[5] | — |
| CE Segregation | — | Cu[5] | — |
| PC Arm assembly | — | AMAT 0010-25311 (3)[5] | — |
| iScan EndPoint module | — | AMAT 0010-37905[5] | — |
| Vintage | — | 2011[5] | — |
| Wafer size | — | — | 300 mm[8] |
| Removal rate | — | — | >6452 Å/min[8] |
| Non-uniformity | — | — | <4%[8] |
| Pressure | — | — | 1.5 psi[8] |
| Slurry flow rate | — | — | 300 ml/min[8] |
| Platen/Carrier rotary speed | — | — | 97/103 rpm[8] |
| Gas delivery | — | — | 300 ml/min[6] |