Waferpedia

Comparison ledger

AD 838 L Dual Epoxyversus103-754

ASM AD 838 L Dual Epoxy, Cascade Microtech 103-754, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
103-754Cascade Microtech
OEMASMCascade Microtech
CategoryTest & ProbeTest & Probe
Wafer sizeWafer table with wafer expander for 8”6-inch diameter microchamber and thermal chuck
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AD 838Cascade Microtech 103-754
Specifications
Wafer sizeWafer table with wafer expander for 8”[1]—
ConfigurationNeedle ejector[1]—
type—x-y-z-θ probe positioner[2]
installed on—HFTL 50-GHz Small-Signal Probe Station[2]
quantity in station—two[2]
station chuck size—6-inch-diameter microchamber and thermal chuck[2]
Quantity per station—Two positioners[2]
Chuck size—6-inch-diameter microchamber and thermal chuck[2]
Temperature range—-50 to 200 °C[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]cnf.cornell.educnf.cornell.edu