Comparison ledger
Axcelis 200 ACU, Lam Research 2300 Versys Kiyo 45, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | 2300 Versys Kiyo 45Lam Research |
|---|---|---|
| OEM | Axcelis | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Lam Research 2300 Versys Kiyo 45 |
| Specifications | ||
| Configuration | Parts Machine[1] | — |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | 2300 Versys Kiyo 45[5] |
| Tool type | Asher[1] | high-density plasma etch system[6] |
| Wafer size | 200mm[3] | 300mm[7] |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| OEM | — | Lam Research[5] |
| Category | — | Etch[6] |
| Application | — | advanced patterning applications[6] |
| Processes | — | conductor and silicon etch processes[6] |
| Etch characteristics | — | precise anisotropic etching, excellent critical dimension control, and high aspect ratio capability[6] |
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