Waferpedia

Comparison ledger

20 36 SurfaceversusDAD 322 Automatic Dicing

Blanchard 20 36 Surface, Disco DAD 322 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DAD 322 Automatic Dicing
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Blade inner diameter—40 mm[2]
Blade outer diameter—>49.4 mm[2]
Maximum cutting depth—(O.D. - 49.4 mm) / 2 mm[2]
Blade thickness range—15 µm to 200 µm[2]
Wafer mounting—UV tape[2]
Cooling—Deionized water[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]hope.site.nthu.edu.twhope.site.nthu.edu.tw