Waferpedia

Comparison ledger

20 36 SurfaceversusDFL 7160 Laser Dicing

Blanchard 20 36 Surface, Disco DFL 7160 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DFL 7160
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]Non-operational[2]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Equipment type—Fully automatic laser saw[3]
Max. workpiece size—Φ300 mm[3]
Processing method—Ablation[3]
Laser wavelength—355 nm[4]
Laser maximum power—18 W[4]
X-axis processing range—310 mm[3]
Y-axis processing range—310 mm[3]
X-axis moving speed—0.1–600 mm/s[3]
X-axis index step—0.0001 mm[3]
Positioning accuracy—0.003/310 mm (single error), 0.002/5 mm[3]
Z-axis moving resolution—0.00005 mm[3]
Repeatability accuracy—0.002 mm[3]
θ-axis max. rotating angle—380 deg[3]
Equipment dimensions—1,200 × 1,550 × 1,800 mm[3]
Equipment weight—Approx. 1,750 kg[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]disco.co.jpdisco.co.jp
  4. [4]semistarcorp.comsemistarcorp.com