Waferpedia

Comparison ledger

No. II Rotaryversus15

Blanchard No. II Rotary, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
No. II RotaryBlanchard
15Lapmaster
OEMBlanchardLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard No. II RotaryLapmaster 15
Specifications
Input Power—110 Vac[1]
Plate Diameter—15 inches (381 mm)[2]
Number of Conditioning Rings—3[2]
Ring ID—5.5 inches (140 mm)[2]
Standard RPM—60[2]
RPM Range (Variable Speed Drive)—0-60[2]
Drive Motor - Lapper—0.5 HP (0.37 kW)[2]
Drive Motor - Polisher—0.75 HP (0.56 kW)[2]
Length—25 inches (635 mm)[2]
Width—20 inches (508 mm)[2]
Height—24 inches (610 mm)[2]
Estimated Shipping Weight—285 lbs (129.3 kg)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org