Comparison ledger
Brooks 017-0024-01 Prealigner, Laurell SU-8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 017-0024-01 PrealignerBrooks | SU-8Laurell |
|---|---|---|
| OEM | Brooks | Laurell |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Brooks 017-0024-01 Prealigner | Laurell SU-8 |
| Specifications | ||
| Equipment name | — | Spin Station- Laurell- SU-8 ONLY[1] |
| Category | — | Lithography[1] |
| Type | — | Spin station[1] |
| Photoresist Type | — | SU-8 (negative epoxy photoresist)[2] |
| Exposure Wavelength | — | i-line (365 nm)[2] |
| Maximum Absorption | — | Ultraviolet light at 365 nm[2] |
| Film Thickness Range (single spin coat) | — | 1 to >200 μm[3] |
| Maximum Film Thickness (multiple coats or dry film) | — | Up to above 300 μm (spun) or above 1 mm (dry film)[2] |
| Aspect Ratio (achieved) | — | >20 with solution formulation; >40 with dry resist[2] |
| Operational Mode | — | Dedicated to SU-8 only[1] |
| Spin Speed (recommended for reproducibility) | — | 3000 rpm[4] |
| Soft Bake Temperature (typical first step) | — | 65 °C[3] |
| Soft Bake Temperature (typical second step) | — | 95 °C[3] |
| Post Exposure Bake Temperature (first step) | — | 65 °C[3] |
| Post Exposure Bake Temperature (second step) | — | 95 °C[3] |
| Hard Bake Temperature (optional) | — | 150 °C[5] |
| Developer | — | 1-methoxy-2-propanol acetate (PGMEA) or SU-8 Developer[2] |
| Substrate Size (example used in research) | — | 150 mm (6-inch) silicon wafer[6] |
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