Waferpedia

Comparison ledger

103-754versusTS 3500 Automatic Wafer

Cascade Microtech 103-754, MPI TS 3500 Automatic Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
103-754Cascade Microtech
OEMCascade MicrotechMPI
CategoryTest & ProbeTest & Probe
Wafer size6-inch diameter microchamber and thermal chuckWafer ID Reader
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCascade Microtech 103-754MPI TS 3500 Automatic Wafer
Cited variants—
  • TS3500-IFE[1]
  • TS3500-SE[1]
  • TS3500-SE with WaferWallet[1]
  • TS3500-SE with WaferWallet MAX[1]
Specifications
typex-y-z-θ probe positioner[2]—
installed onHFTL 50-GHz Small-Signal Probe Station[2]—
quantity in stationtwo[2]—
station chuck size6-inch-diameter microchamber and thermal chuck[2]—
Quantity per stationTwo positioners[2]—
Chuck size6-inch-diameter microchamber and thermal chuck[2]—
Temperature range-50 to 200 °C[2]—
Software—Sentio[3]
AST—RC-300 T-SA[4]
TS 3500 Series replaces PN—RC 300 T[4]
Wafer size—Wafer ID Reader[3]
Manufacturer—MPI[3]
Category—Test & Probe[3]
Automation—300 mm fully automated probe station[1]
Supported wafer sizes—150, 200, or 300 mm[5]
Wafer ID-Reader—Option for top or bottom ID reading[5]
Wafer pre-aligner—Included[5]
Cassette scanner—Included[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]mpi-corporation.commpi-corporation.com
  2. [2]cnf.cornell.educnf.cornell.edu
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing
  5. [5]mpi.com.twmpi.com.tw